Ebook Advanced Electronic PackagingFrom Wiley-IEEE Press
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Advanced Electronic PackagingFrom Wiley-IEEE Press
Ebook Advanced Electronic PackagingFrom Wiley-IEEE Press
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As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained.
An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
- Sales Rank: #2004869 in Books
- Published on: 2006-02-24
- Original language: English
- Number of items: 1
- Dimensions: 10.14" h x 1.76" w x 7.20" l, 3.38 pounds
- Binding: Hardcover
- 840 pages
Review
"…a very nice reference." (IEEE Circuits & Devices Magazine, November/December 2006)
"...offers a broad perspective on electronic packaging." (Advanced Packaging Online, August 11, 2006)
"...an extremely thorough engineering textbook and an invaluable reference tool...get ready for some serious reading that will pay off." (Chip Scale Review, July 2006)
"…useful to not only students but also to both new and experienced engineers working in areas related to semiconductor and electronic packaging technologies." (CircuiTree, May 1, 2006)
From the Back Cover
Advanced Electronic Packaging, Second Edition reflects the changes in the electronic packaging industry, as well as feedback from students, engineers, and educators since the publication of the First Edition in 1999. Like the First Edition, each chapter is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout.
Readers familiar with the First Edition will note several key changes. For example, organic and ceramic substrates are now covered in separate chapters. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly. In addition, readers have access to the latest information and findings in such topics as:
- Packaging materials and applications
- Modeling and simulations
- Analytical techniques for materials
- MEMS packaging
- Fabrication technologies and package design
- Reliability
- Electrical, mechanical, and thermal considerations
- Three-dimensional packaging
All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Examples illustrate real-world applications, which are then reinforced by the extensive use of exercises to enable readers themselves to place their newfound knowledge into practice. In addition, references are provided that guide readers to more in-depth information and primary resources in specialized topics.
Fully updated, this comprehensive reference remains the preeminent graduate-level textbook in its field as well as an essential reference for engineers and scientists.
About the Author
Richard K. Ulrich is a professor of chemical engineering at the University of Arkansas. He is a book editor and columnist on embedded passive technology, a NEMI committee member, an associate editor of IEEE Transactions on Advanced Packaging, and past chairman of chairman of the Dielectric Science and Technology Division of the Electrochemical Society.
WILLIAM D. BROWN, PhD, is Associate Dean for Research, College of Engineering, and Distinguished Professor of Electrical Engineering, University of Arkansas. Since 1991, he has played an active role in sponsoring and guiding research at the University's High Density Electronics Center (HiDEC), which is dedicated to advancing the state of the art in electronics packaging materials and technologies.
Most helpful customer reviews
1 of 1 people found the following review helpful.
Informative and fun to read.
By KDOGG
The book is very informative and I like how the writer writes. The struggles of this family of packages as they are shipped from China to the US searching for a home is a modern day American Tail. I cried when the DPI shortcircuited and I laughed when the QFP fell off the MB into the Flip Chip mount. Great story and vision. 10/10
0 of 0 people found the following review helpful.
Five Stars
By mahfod alnami
AAAAAAAAA ++++++ Fast shipping, thank you very much
0 of 0 people found the following review helpful.
Outstanding Reference for a Practicing Packaging Engineer
By Lawrence A
I bought this book for a packaging class that I took, but didn't realize how useful it is until I found myself in the position of managing subcon packaging houses. Virtually everything that could be needed on a day-to-day basis is contained within this book, except perhaps for tips on project management in the absence of carrots or sticks.
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